Download Datasheets MCRF450 Device 
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Download Datasheets MCRF450 Device


The MCRF45x family is a contactless read/write passive Radio Frequency Identification (RFID) IC device that is optimized for 13.56 MHz RF carrier signal. The device needs an external LC resonant circuit to communicate with interrogator wirelessly. The device is powered remotely by rectifying a RF signal that is transmitted from the interrogator, and transmits or updates its contents of memory based on commands from the interrogator. The MCRF45x is engineered to be used effectively for item level tagging applications such as retail and inventory management, where a large volume of tags are read and written in the same interrogator field. The MCRF45x contains 32 blocks of EEPROM memory. Each block consists of 32 bits. The device also features two operational modes depending on the conditions of talk first (TF) and fast read (FR) bits. These modes are "tag talks first" (TTF) and "interrogator talks first" (ITF) modes. The MCRF45x also includes a unique anti-collision algorithm to be read or written effectively in multiple tag environments. To minimize data collision, the algorithm utilizes time division multiplexing of the device response so each device communicates with the interrogator in a different time slot. Part options include: MCRF450 = no on-chip capacitor (requires an external resonant capacitor), MCRF451 = 100 pF on-chip resonant capacitor, MCRF452 = 50 pF on-chip dual capacitor (for a total of 25 pF) for 2 antenna connections, MCRF 455 = 50 pF on-chip resonant capacitor.

Datasheet and Other Documentation

Detailed Content

Lit. Number

Download

 

MCRF450 Datasheet

40232e

Download MCRF450 Datasheet

Program Memory

Status

1K bits

In Production

Specification Chart

Carrier Freq

Contactless Prog

Anti Collision

Memory

13.56 MHz

Yes

Yes

Read / Write

Additional Features

Interrogator-Talk-First (ITF) and Tag-Talk-First (TTF) modes, 32-bit EAS function, 70kHz data rate, 1K bit memory, write protectable by block, EAS Function (FRB)

Package Options

Die(S), Wafer(W), Wafer on Frame(WF), Bumped Die(SB), PDIP(P), Bumped Wafer on Frame(WFB), Bumped Wafer(WB), SOIC 300mil(SO), COB(7M)



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